Apple came up with a new power system in the both iPhone 6S and iPhone 6Splus, they added more functions to the new
power IC ( D2255A080UXUVAI2 ). This will improve the performance of the phone and reduce the expected problems, but in the other hand that will complicate the repair process and rise the risk, why...!?
Well because we have to be worried about three things:
- The CPU in the other side off the board, so over heating is a problem.
- The power IC is protected with an anti shock material making the replacing process harder
- The Power IC itself is thin and that make it easy to be cracked or damaged while removing
- The commponent around the IC are very close to it.
How to deal with that..?
- You need to remove some components ( ex. capacitors ) that are located beside the power IC, that will make you more comfortable while removing the IC and allow you to locate your tweezer correctly.
- Use a suitable tip for your hot station (the diameter close to the width of the IC) that will heat the whole IC in the same time so you don't lose pins while removing it and reduce the heating time so you don't damage the CPU.
- When you stick the tweezer under the IC in order to remove it, do it slowly cause the IC is thin, when the IC gets heated enough, start rising the IC slowly.
What about the anti shock material..?:
The anti shock material must be cleaned well in order to get the best connection between the IC and the board. Use the hot station with low temperature to heat the material then remove it slowly with a tweezer, be carefull not to lose any pads (contacts) from the board.
The picture shows the iPhone 6S power IC after removing process that we made in SFS Lab.